Abstarct: The existing letter is baxsed on a scientific basis for making thermally conductive adhesives and electrical insulation for use in electronic boards and gluing heat sinks and electronic ICs. It should be noted that its thermal conductivity coefficient is low, maximum (3 W/mK).To improve this process, we first identified the appropriate adhesives for the boards, and after the FTIR test, we identified the SMD adhesive that is used to stick the ICs on the board; This glue is Epoxy to complete the process of identifying the powders inside it by XRD test, calcium carbonate were identified by Xpert software and the test results were carefully checked.After examining the chemical and physical properties of epoxy adhesive, we selected various types of oxide powders for thermal conductivity and electrical insulation, such as SiO2, MgO, CaO, Al2O3, and ZnO, and then after researching adhesive tests in the testing department, we started making thermal conductive adhesives using Strength and thermal conductivity were determined from these powders and tests. Again, the thermal conductivity was low, so industrial graphite was used to increase the conductivity, which became 20% percolation threshold electrical conductivity.After research, we came to a completely innovative material called fly ash, which after XRF contains all kinds of oxides and a large amount of carbon. From its use in glue with aluminum oxide with different and appropriate percentages and the relevant tests of the glue, we have achieved very good glues(8.2 W/mK ) with high resistance.